Burn In Test Probe
Package #22: BALL GRID ARRAYS (BGA)
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Tags: ball grid arrays, bga package, test probe, y456-1, y48-0, y54-0
1.TestProbe | admin September 22, 2009 | 
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Burn In Test Probe
Package #19: THIN SOP (TSOP)
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Tags: test probe, thin sop, tsop package, v32-6, v40-4, v40-5, v50-5
Burn In Test Probe
Package #18: TAPE AUTOMATED BONDING (TAB)
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Tags: tab package, tape automated bonding, test probe, u192-2, u256-1, u80-1